The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Jul. 26, 2024
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Ravindranath Doddi, Hyderabad, IN;

Umamaheshwaran V, Salem, IN;

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 11/20 (2006.01);
U.S. Cl.
CPC ...
G06F 11/2002 (2013.01); G06F 2201/805 (2013.01);
Abstract

An integrated circuit (IC) device includes a plurality of chiplets including a first device and a second device. A die-to-die (D2D) interconnect link connects between the first device and the second device. A link training and status state machine (LTSSM) of the IC device is configured to operate the degraded D2D interconnect link in a resilient link mode to provide a plurality of enabled lanes and a plurality of disabled lanes. The LTSSM detects a faulty lane among the plurality of enabled lanes, and replaces the faulty lane using a functional lane from the plurality of disabled lanes to maintain the degraded D2D interconnect link.


Find Patent Forward Citations

Doddi, Ravindranath. (2026). Interconnect link with a resilient link mode based on a link status register (U.S. Patent No. 12608289). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12608289

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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