Ravindra Raghavendra

Title: Innovations by Ravindra Raghavendra

Introduction

Ravindra Raghavendra is an accomplished inventor based in Singapore, SG. He holds a total of 4 patents that showcase his expertise in the field of electronic device encapsulation and molding processes. His innovative contributions have significantly impacted the technology sector.

Latest Patents

One of his latest patents is an encapsulation process for double-sided cooled packages. This invention involves one or more electronic devices mounted on a substrate, which includes at least one cooling plate in contact with the devices. The substrate is clamped between two mold halves that define a molding cavity for the encapsulation process. A cavity insert is projected into the cavity to apply sealing pressure onto the cooling plate. The molding compound is introduced at a first fill pressure and packed at a second fill pressure, which is higher than the first. Throughout this process, the sealing pressure is maintained at values exceeding both fill pressures.

Another notable patent is related to a molding press and a platen for encapsulating semiconductor dies on a substrate. This invention features a platen that cooperates with another platen to clamp the substrate between their mold chase surfaces, defining a mold cavity. The platen includes a rotational mounting device that allows for the adjustment of the mold chase surfaces' relative arrangement, enhancing the encapsulation process.

Career Highlights

Ravindra has worked with prominent companies such as ASM Technology Singapore Pte Ltd and ASMPT Singapore Pte. Ltd. His experience in these organizations has contributed to his development as a leading inventor in the field.

Collaborations

Throughout his career, Ravindra has collaborated with talented individuals, including coworkers Teng Hock Kuah and Zilan Li. These collaborations have fostered innovation and creativity in his projects.

Conclusion

Ravindra Raghavendra's contributions to the field of electronic device encapsulation and molding processes are noteworthy. His patents reflect his commitment to innovation and excellence in technology.