Asm Technology Singapore Pte Ltd

Asmpt Singapore Pte. Ltd.

Ravindra Raghavendra

Teng Hock Kuah

Jiapei Ding

Zilan Li

Shu Chuen Ho

Kar Weng Yan

Yi Yu Lin

Jian Xiong Su

Chidambaram Palaniappan

Angelito Barrozo Perez

One or more electronic devices that are mounted on a substrate, including at least one cooling plate in contact with the one or more electronic devices, are encapsulated. The substrate is clamped between a first mold half and a second mold half which define a molding cavity for molding the one or more electronic devices. A cavity insert movably located in the first mold half is projected into the cavity in order to contact and apply a sealing pressure onto the at least one cooling plate. After introducing a molding compound into the cavity at a first fill pressure, the molding compound in the cavity is packed by applying a second fill pressure which is higher than the first fill pressure. During this time, the sealing pressure is maintained at values that are higher than the first fill pressure and the second fill pressure.

Encapsulation process for double-sided cooled packages

Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.

Molding press and a platen for a molding press

A feed-through apparatus for a chemical vapor deposition device including: a feed-through main body; a plurality of runner units; and a feed-through device rotatable with respect to the plurality of runner units within the feed-through main body. Each runner unit has a fluid inlet and an elongated runner for receiving the fluid from the fluid inlet wherein the elongated runner extends spirally on a surface of the runner unit. The feed-through device has a plurality of feed-through device orifices for receiving fluids from corresponding elongated runners during rotation of the feed-through device and has outlet-orifices for releasing the fluids into a reactor chamber.

Feed-through apparatus for a chemical vapour deposition device

An apparatusfor depositing a thin-film onto a surface of a substrateusing precursor gases G, Gis disclosed. The apparatuscomprises i) a supporting devicefor holding the substrate; and ii) a spinnerpositioned adjacent to the supporting device. Specifically, the spinnerincludes a hubfor connecting to a motor, and one or more bladesconnected to the hub. In particular, the one or more bladesare operative to rotate around the hubon a plane to drive a fluid flow of the precursor gases G, G, so as to distribute the precursor gases G, Gacross the surface of the substrate

Apparatus for thin-film deposition

Growing community of inventors

Singapore, Singapore

Ravindra Raghavendra