Company Filing History:
Years Active: 2006-2008
Title: Ralph Lane: Innovator in Semiconductor Technology
Introduction
Ralph Lane is a notable inventor based in Gilbert, AZ (US), recognized for his contributions to semiconductor technology. With a total of 2 patents, he has made significant advancements in the field, particularly in etching processes that enhance the manufacturing of semiconductor devices.
Latest Patents
Ralph Lane's latest patents include a method for multi-step etch for metal bump formation. This invention utilizes a two-step plasma etch process to create a via contact with an integral bump. After the via and bump have been plated, the semiconductor substrate is planarized to remove excess metal, using the semiconductor substrate as a planar stop. Additionally, he has developed a method for creating a tapered via using a receding mask. This method involves an etch mask formed on a substrate, which includes a first aperture in a first photoresist layer and a second, larger aperture in an overlying second photoresist layer. The etching process creates a tapered via in the substrate, allowing for innovative designs in semiconductor manufacturing.
Career Highlights
Ralph Lane is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing processes that improve the efficiency and effectiveness of semiconductor fabrication.
Collaborations
Throughout his career, Ralph has collaborated with talented individuals such as Charles Christopher Hill and Tony Dambrauskas. These collaborations have fostered an environment of innovation and creativity, leading to groundbreaking advancements in the field.
Conclusion
Ralph Lane's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of semiconductor manufacturing.