The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2008

Filed:

Jun. 30, 2005
Applicants:

Tony Dambrauskas, Mesa, AZ (US);

Ralph Lane, Gilbert, AZ (US);

Inventors:

Tony Dambrauskas, Mesa, AZ (US);

Ralph Lane, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention uses a two step plasma etch process to create a via contact with an integral bump. After the via and bump have been plated, the semiconductor substrate is planarized to remove the excess metal, using the semiconductor substrate as a planar stop. The bulk silicon substrate surrounding the bumps are plasma etched back to expose the bumps for assembly.


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