Company Filing History:
Years Active: 1994-2011
Title: Rajiv Rastogi: Innovator in Electroplating Technologies
Introduction
Rajiv Rastogi is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of electroplating, holding a total of 5 patents. His work focuses on improving deposition processes and enhancing the quality of electroplated materials.
Latest Patents
One of Rajiv Rastogi's latest patents is titled "Using cell voltage as a monitor for deposition coverage." This invention describes a method and apparatus that utilize cell voltage and/or current to prevent electrochemical deposition tools from deplating wafers that have inadequate metal seed coverage. Another notable patent is "Method of copper electroplating to improve gapfill." This patent provides a copper electroplating bath composition and a method that includes an aqueous electroplating composition with specific concentrations of various agents to enhance gapfill during the electroplating process.
Career Highlights
Rajiv Rastogi is currently employed at Intel Corporation, where he applies his expertise in electroplating technologies. His innovative approaches have contributed to advancements in semiconductor manufacturing processes.
Collaborations
Rajiv has collaborated with notable coworkers, including Yang Cao and Yue Ma, who share his commitment to innovation in the field.
Conclusion
Rajiv Rastogi's contributions to electroplating technologies demonstrate his dedication to advancing manufacturing processes. His patents reflect a deep understanding of the complexities involved in electrochemical deposition, making him a valuable asset in the industry.