Portland, OR, United States of America

Raiyomand F Aspandiar

This inventor holds 20 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2002-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raiyomand F Aspandiar. Retrieved from https://idiyas.com/inventor/raiyomand-f-aspandiar

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 45.0

Average Co-Inventor Count = 3.9

ph-index = 8

Forward Citations = 131(Granted Patents)


Location History:

  • Porland, OR (US) (2005)
  • Portland, OR (US) (2002 - 2024)

Company Filing History:


Years Active: 2002-2024

Loading Chart...
Areas of Expertise:
Silicon Photonic Lens
Decoupling Layer
Conformal Coating
Lead-Free Solder
Heat Sink Anchor
PCB Assembly
Microelectronic Interposer
Epoxy Washer
Zero Insertion Force Pin
Endothermic Material
Surface Mount Component
Embedded Thermocouple
20 patents (USPTO):Explore Patents

Title: Raiyomand F Aspandiar: Innovator in Silicon Photonics

Introduction: Raiyomand F Aspandiar, based in Portland, OR, is a prolific inventor with a remarkable portfolio of 20 patents to his name. His work primarily focuses on advancements in optoelectronic systems, showcasing his commitment to pushing the boundaries of technology in the field of silicon photonics.

Latest Patents: Aspandiar's latest innovations include two significant patents. The first is a "Silicon photonic integrated lens compatible with wafer processing," which involves optoelectronic systems and methods for forming such systems. This invention includes a board with a carrier that holds a photonics die, ensuring the first die's surface is safeguarded by an optically transparent layer.

The second patent, titled "Decoupling layer to reduce underfill stress in semiconductor devices," describes an integrated circuit assembly that minimizes stress transfer from underfill materials to semiconductor devices. The assembly features a novel decoupling layer that weakly bonds with underfill materials, utilizing materials such as PTFE films or poly(p-xylylene) films, contributing to enhanced performance in devices like quantum well laser devices.

Career Highlights: Aspandiar's career is marked by his association with Intel Corporation, where he has significantly contributed to cutting-edge research and development in semiconductor technologies. His extensive list of patents underscores his innovative spirit and dedication to developing next-generation technologies.

Collaborations: Throughout his career, Aspandiar has collaborated with notable colleagues, including Christopher D Combs and Tom E Pearson. These collaborations have fostered an environment of shared ideas and mutual growth in the field of optical and semiconductor innovation.

Conclusion: Raiyomand F Aspandiar stands out as a leading inventor in the realm of silicon photonics. His contributions through innovative patents reflect not only his expertise but also a vision for the future of technology. As the industry continues to evolve, Aspandiar's work will undoubtedly play a vital role in shaping advancements in optoelectronic systems and semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…