The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Sep. 06, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Priyanka Dobriyal, Milpitas, CA (US);
Ankur Agrawal, Chandler, AZ (US);
Susheel Jadhav, Chandler, AZ (US);
Quan Tran, Fremont, CA (US);
Raghuram Narayan, Newark, CA (US);
Raiyomand Aspandiar, Portland, OR (US);
Kenneth Brown, Tempe, AZ (US);
John Heck, Berkeley, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/0232 (2014.01); G02B 3/00 (2006.01); H01L 31/0216 (2014.01); H01L 25/16 (2023.01); H01L 31/18 (2006.01); G02B 1/11 (2015.01); G02B 6/42 (2006.01); H01L 23/538 (2006.01); G02B 6/24 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); G02B 1/11 (2013.01); G02B 3/0012 (2013.01); G02B 3/0056 (2013.01); G02B 6/428 (2013.01); H01L 23/5385 (2013.01); H01L 25/167 (2013.01); H01L 31/02005 (2013.01); H01L 31/02019 (2013.01); H01L 31/02161 (2013.01); H01L 31/1876 (2013.01); G02B 6/241 (2013.01);
Abstract
Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.