Tragöß, Austria

Rainer Frauwallner

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 3.0

ph-index = 1


Location History:

  • Tragöß, AT (2021 - 2022)
  • Tragöss-St. Katharein, AT (2022)

Company Filing History:


Years Active: 2021-2022

Loading Chart...
Loading Chart...
3 patents (USPTO):Explore Patents

Title: Rainer Frauwallner: Innovator in Embedded Power Systems

Introduction

Rainer Frauwallner is a notable inventor based in Tragöß, Austria. He has made significant contributions to the field of embedded power systems, holding a total of 3 patents. His innovative work focuses on improving the efficiency and functionality of component carriers in electronic systems.

Latest Patents

One of Rainer's latest patents is titled "Cooling profile integration for embedded power systems." This invention involves a component carrier that includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded within this stack, with a first thermally conductive block positioned above and thermally connected to the component, and a second thermally conductive block located below and thermally coupled with the component. This design effectively removes heat generated by the component during operation through the thermally conductive blocks.

Another significant patent is "Solder-free component carrier connection using an elastic element and method." This patent describes a component carrier that features a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. It also includes at least one elastic element attached to the stack, which is designed to reversibly connect the component carrier with another component carrier. This connection is achieved by elastically deforming the elastic element while keeping the stack and the additional component carrier essentially undistorted.

Career Highlights

Rainer Frauwallner is currently employed at AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the field of high-tech printed circuit boards and advanced packaging solutions. His work at AT&S has allowed him to push the boundaries of innovation in embedded systems.

Collaborations

Throughout his career, Rainer has collaborated with talented individuals such as Christian Vockenberger and Thomas Krivec. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Rainer Frauwallner's contributions to the field of embedded power systems exemplify the spirit of innovation. His patents not only enhance the efficiency of electronic components but also pave the way for future advancements in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…