At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Rainer Frauwallner

Jonathan Silvano De Sousa

Christian Vockenberger

Marco Gavagnin

Gernot Grober

Mike Morianz

Heinz Moitzi

Erich Schlaffer

Thomas Krivec

Gernot Schulz

Dietmar Drofenik

Ferdinand Lutschounig

Markus Leitgeb

Patrick Fleischhacker

Gernot Gmundner

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.

Cooling profile integration for embedded power systems

A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.

Solder-free component carrier connection using an elastic element and method

Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.

Component carrier with integrated inductor and manufacturing method

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Tragöß, Austria

Rainer Frauwallner