The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Feb. 19, 2021
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Rainer Frauwallner, Tragöss-St. Katharein, AT;

Dietmar Drofenik, Spielberg, AT;

Patrick Fleischhacker, Graz, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0207 (2013.01); H05K 1/182 (2013.01); H05K 1/183 (2013.01); H05K 1/184 (2013.01); H05K 1/185 (2013.01); H05K 3/4644 (2013.01);
Abstract

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.


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Frauwallner, Rainer. (2022). Cooling profile integration for embedded power systems (U.S. Patent No. 11523496). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11523496

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