The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Jun. 19, 2019
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Rainer Frauwallner, Tragöß, AT;

Marco Gavagnin, Leoben, AT;

Christian Vockenberger, Leoben, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H02M 3/155 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H02M 3/155 (2013.01); H05K 3/0011 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/086 (2013.01);
Abstract

Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.


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