Woodland Hills, CA, United States of America

Raed A Sherif

This inventor holds 30 USPTO granted patents and 1 EPO patent, primarily in Thermal Management. Top assignees: International Business Machines Corporation, The Boeing Company, Hughes Electronics Corporation. Active years: 1993-2014.

USPTO Granted Patents = 30

% Patents Active = 93.3

EPO Patents = 1

Average Co-Inventor Count = 4.3

ph-index = 18

Forward Citations = 1,028(Granted Patents)

Location History:

Pleasant Valley, NY (US) (1993)
Hopewell Junction, NY (US) (1997 - 1999)
Croton, NY (US) (1998 - 2001)
Croton-on Hudson, NY (US) (1999 - 2002)
Woodland Hills, CA (US) (2001 - 2002)
Valencia, CA (US) (2003 - 2014)

Company Filing History:

27 out of 166,264

International Business Machines Corporation

Hughes Electronics Corporation

patents

Years Active: 1993-2014

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Areas of Expertise:

Solar Cell

Photovoltaic Concentrator

Thermal Interface

Chip Assembly

Multi-Chip Module

Hermetic Seal

Cooling Method

Thermal Cap

Solder Seal

Cooling System

Heat-Sink

Semiconductor Package

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8697987 - Solar cell having front grid metallization that does not contact the active layers (2014-04-15),

2. 6531653 - Low cost high solar flux photovoltaic concentrator receiver (2003-03-11),

3. 6459160 - Package with low stress hermetic seal (2002-10-01),

4. 6373133 - Multi-chip module and heat-sink cap combination (2002-04-16),

5. 6350944 - Solar module array with reconfigurable tile (2002-02-26),

6. 6342407 - Low stress hermetic seal (2002-01-29),

7. 6333460 - Structural support for direct lid attach (2001-12-25),

8. 6330157 - Variable thermal exchanger and method thereof (2001-12-11),

9. 6294408 - Method for controlling thermal interface gap distance (2001-09-25),

10. 6255139 - Method for providing a thermal path through particles embedded in a thermal cap (2001-07-03),

11. 6222263 - Chip assembly with load-bearing lid in thermal contact with the chip (2001-04-24),

12. 6218730 - Apparatus for controlling thermal interface gap distance (2001-04-17),

13. 6111314 - Thermal cap with embedded particles (2000-08-29),

14. 6049456 - Electronic module adjustment design and process using shims (2000-04-11),

15. 5990418 - Hermetic CBGA/CCGA structure with thermal paste cooling (1999-11-23),

Title: The Inventor Raed A Sherif: Pioneering Innovations in Woodland Hills

Introduction: Raed A Sherif is a distinguished inventor based in Woodland Hills, CA, known for his groundbreaking contributions to the field of technology and beyond.

Latest Patents: Raed A Sherif holds several patents in various industries, including telecommunications, renewable energy, and healthcare, showcasing his versatility and ingenuity.

Career Highlights: With a career spanning over two decades, Raed A Sherif has worked with leading tech companies, research institutions, and universities, consistently pushing the boundaries of what is possible through his inventive spirit.

Collaborations: Throughout his career, Raed A Sherif has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and excellence in all his projects.

Conclusion: Raed A Sherif's passion for innovation and his relentless drive to create a positive impact on the world make him a true visionary in the realm of inventions.