The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2001

Filed:

Aug. 05, 1999
Applicant:
Inventors:

David L. Edwards, Poughkeepsie, NY (US);

Patrick A. Coico, Fishkill, NY (US);

Sushumna Iruvanti, Wappingers Falls, NY (US);

Frank L. Pompeo, Montgomery, NY (US);

Raed A. Sherif, Croton, NY (US);

Hilton T. Toy, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/148 ;
U.S. Cl.
CPC ...
H01L 2/148 ;
Abstract

The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.


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