The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 1999
Filed:
Jul. 29, 1997
Kevin G Bivona, Poughkeepsie, NY (US);
Jeffrey T Coffin, Pleasant Valley, NY (US);
Stephen S Drofitz, Jr, Wappingers Falls, NY (US);
Lewis S Goldmann, Bedford, NY (US);
Mario J Interrante, New Paltz, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
Raed A Sherif, Croton-on Hudson, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The device includes an integrated circuit chip, carrier substrate, interface coolant, and a lid. The integrated circuit chip is attached to the top of the carrier substrate. The interface coolant is disposed on the top of the integrated circuit chip and the lid is placed on top of the carrier substrate/integrated circuit chip combination and contacts the interface coolant. The interface coolant provides a thermal path for conducting heat from the integrated circuit chip to the lid. The substrate is attached to a circuit board by a ceramic ball grid array (CBGA) or a ceramic column grid array (CCGA).