The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2001
Filed:
Sep. 30, 1999
David L. Edwards, Poughkeepsie, NY (US);
Michael J. Emmett, Poughkeepsie, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
Raed A. Sherif, Woodland Hills, CA (US);
Kamal Sikka, Wappingers Falls, NY (US);
Hilton T. Toy, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and apparatus for electronic chip assembly maintains a thin gap spacing between the chip and the lid or heat sink and provides for the electronic chip to operate at a relatively cool temperature. The thermal performance is enhanced by a thermal interface material provided in the thin gap and maintained at a minimal thickness as a result of the structure and assembly process. A thin thermal interface material layer may be achieved with a compression step to compress the thermal interface material before the sealant is cured. In addition, a vent hole is provided in the assembly to prevent pressure build-up inside the module during sealant cure. As the sealant is cured, the gap spacing is maintained, further compression of the thermal interface material is not required, and seal defects are prevented.