This inventor holds 6 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignee: Future Wei Technologies, Inc.. Active years: 2017-2018.
Company Filing History:
Years Active: 2017-2018
Title: Qian Han: Innovator in Thermal Reliability and Bonding Quality
Introduction
Qian Han is a prominent inventor based in San Diego, CA, known for his contributions to the fields of thermal reliability and bonding quality in multi-chip modules. With a total of 6 patents to his name, he has made significant advancements that enhance the performance and reliability of electronic components.
Latest Patents
One of Qian Han's latest patents is a system and method for measuring the thermal reliability of multi-chip modules. This innovative method involves selecting a chip with higher thermal risk from a plurality of chips in the module and measuring various predetermined temperature parameters associated with the selected chip. By calculating thermal resistance using these parameters, the thermal performance of the multi-chip module can be effectively determined. The parameters include junction temperature, case temperature, board temperature, and ambient air temperature.
Another notable patent is a system and method for testing chip-on-glass bonding quality. This method includes a glass panel with two interconnected test pads and a display driver. The adhesive layer between the glass panel and the display driver contains conductive portions that form an electrical testing loop. This loop is designed to measure voltage drop across the conductive portions, ensuring the quality of the bonding.
Career Highlights
Qian Han has worked with several notable companies throughout his career, including Future Wei Technologies, Inc. and Huawei Technologies Co., Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in his field.
Collaborations
Throughout his career, Qian has collaborated with talented individuals such as Guoping Luo and Yongwang Xiao. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Qian Han's work in thermal reliability and bonding quality has made a significant impact on the electronics industry. His innovative patents and collaborations highlight his dedication to advancing technology and improving the performance of electronic components.