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For the Inventor, By the Inventor

San Diego, CA, United States of America

Qian Han

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 1.6

ph-index = 3

Forward Citations = 30(Granted Patents)


Company Filing History:

goldMedal6 out of 3,047 
 
Future Wei Technologies, Inc.
 patents

Years Active: 2017-2018

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6 patents (USPTO):Explore Patents
1. 10156512 - System and method for measuring thermal reliability of multi-chip modules (2018-12-18),
2. 9928767 - System and method for testing chip-on-glass bonding quality (2018-03-27),
3. 9836100 - Support frame with integrated phase change material for thermal management (2017-12-05),
4. 9802279 - Apparatus and method for a molded plastic fin shell for electronic devices (2017-10-31),
5. 9761155 - Skin touch temperature test apparatus and method (2017-09-12),
6. 9547344 - Support frame with integrated thermal management features (2017-01-17),
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