Future Wei Technologies, Inc.

Huawei Technologies Co., Limited

Qian Han

Jun Yang

Yongwang Xiao

Junsheng Guo

Steven Loza

Shunlin Chen

Guangrong Wu

Xiangan Zhu

Jose Garcia

Chuanning Chen

Xiaodu Shao

Steven R Loza

Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.

System and method for measuring thermal reliability of multi-chip modules

A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprising an input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions.

System and method for testing chip-on-glass bonding quality

The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at a isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance.

Support frame with integrated phase change material for thermal management

Embodiments are provided for using a molded thermal plastic fin shell as part of a heat sink design for electronic devices. The heat sink design also includes metal components in contact with the electronics components of the device and the thermal plastic fin shell. The thermal plastic fin shell serves both as part of the heat sink design to dissipate heat to the air and as a protective casing or packaging for the device. The heat is transferred from the electronics components or heat sources in the device to the heat sink metal components and hence to the thermal plastic fin shell in contact with the metal. The thermal plastic fin shell dissipates the heat into the surrounding air. The combination of metal and thermal plastic materials in the heat sink design combines both desired properties of high thermal conductivity and ease of manufacture.

Apparatus and method for a molded plastic fin shell for electronic devices

A method for simulating an effect of surface temperature of an electronic device on skin of a human being when the electronic device is touched by the human being. The method comprises applying heat to a material within a cavity of a body, the body comprising a first end, a second end, an outer surface, and an inner surface that defines the cavity extending between the first end and the second end. The outer surface and the material have heat and thermal conductivity properties similar to human skin. The method comprises sensing a temperature of the material, and sensing a temperature of at least a portion of the outer surface when the portion of the outer surface contacts the electronic device.

Skin touch temperature test apparatus and method

This invention describes a novel solution to providing heat redistribution and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. Liquid (e.g., coolants) contained in the portion of the heat management features most proximate to the processing components evaporates due to the absorbed heat, and is conducted (via convection) towards the other end of the heat management features, where the temperature is cooler. Once sufficiently cooled, the evaporated coolant condenses back into liquid form and flows back towards the other end of the heat management features.

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San Diego, CA, United States of America

Qian Han