The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Jan. 05, 2016
Futurewei Technologies, Inc., Plano, TX (US);
Xiangan Zhu, San Diego, CA (US);
Guoping Luo, Espoo, FI;
Qian Han, San Diego, CA (US);
Shunlin Chen, Shenzhen, CN;
Guangrong Wu, Shenzhen, CN;
Jose Garcia, La Mesa, CA (US);
Steven R. Loza, Menifee, CA (US);
Chuanning Chen, Shenzhen, CN;
Futurewei Technologies, Inc., Plano, TX (US);
Abstract
A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprising an input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions.