The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Oct. 15, 2014
Applicant:

Futurewei Technologies, Inc., Plano, TX (US);

Inventor:

Qian Han, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01); H01L 23/427 (2006.01); G03B 17/55 (2006.01); G03B 15/05 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); G03B 17/55 (2013.01); H01L 23/427 (2013.01); H01L 23/4275 (2013.01); H05K 7/2029 (2013.01); H05K 7/20509 (2013.01); H05K 9/0024 (2013.01); G03B 15/05 (2013.01);
Abstract

The invention is directed to a novel solution to providing heat management and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. The heat management features include phase changing materials that allow the processing components to be kept at a isothermal state through changes in phase, thereby prolonging the duration of time in which the processing components can operate at high performance levels without the need to throttle the performance.


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