Chandler, AZ, United States of America

Poh Chieh Benny Poon

This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2015-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Poh Chieh Benny Poon. Retrieved from https://idiyas.com/inventor/poh-chieh-benny-poon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2015-2017

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2 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Poh Chieh Benny Poon

Introduction:

Poh Chieh Benny Poon is a talented inventor based in Chandler, AZ, United States. With a keen focus on semiconductor technology, Poon has made significant contributions to the field through his innovative patented solutions.

Latest Patents:

Poon's latest patents include "Die Warpage Control for Thin Die Assembly." This groundbreaking technology focuses on controlling die warpage during the assembly of thin dies. By utilizing a backside layer to resist warpage when heated, Poon's inventions have enhanced the efficiency and reliability of semiconductor die assembly processes.

Career Highlights:

Currently employed at Intel Corporation, Poon brings his expertise and ingenuity to one of the leading semiconductor companies in the world. His work reflects a deep understanding of semiconductor technologies and a dedication to pushing the boundaries of innovation in the industry.

Collaborations:

Throughout his career, Poon has collaborated with esteemed colleagues such as Sandeep B Sane and Shankar Ganapathysubramanian. These collaborations have led to the development of cutting-edge solutions and have cemented Poon's reputation as a visionary inventor in the field of semiconductor technology.

Conclusion:

In conclusion, Poh Chieh Benny Poon stands out as a pioneering inventor in the semiconductor industry, with a proven track record of developing innovative solutions to complex technological challenges. His dedication to advancing die assembly processes and controlling die warpage underscores his commitment to driving progress and innovation in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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