The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Sep. 28, 2012
Sandeep B. Sane, Chandler, AZ (US);
Shankar Ganapathysubramanian, San Jose, CA (US);
Jorge Sanchez, Phoenix, AZ (US);
Leonel R. Arana, Phoenix, AZ (US);
Eric J. LI, Chandler, AZ (US);
Nitin A. Deshpande, Chandler, AZ (US);
Jiraporn Seangatith, Chandler, AZ (US);
Poh Chieh Benny Poon, Chandler, AZ (US);
Sandeep B. Sane, Chandler, AZ (US);
Shankar Ganapathysubramanian, San Jose, CA (US);
Jorge Sanchez, Phoenix, AZ (US);
Leonel R. Arana, Phoenix, AZ (US);
Eric J. Li, Chandler, AZ (US);
Nitin A. Deshpande, Chandler, AZ (US);
Jiraporn Seangatith, Chandler, AZ (US);
Poh Chieh Benny Poon, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Die warpage is controlled for the assembly of thin dies. In one example, a device having a substrate on a back side and components in front side layers is formed. A backside layer is formed over the substrate, the layer resisting warpage of the device when the device is heated. The device is attached to a substrate by heating.