Ping Chun Benson Chong

Title: Innovations by Ping Chun Benson Chong

Introduction

Ping Chun Benson Chong is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of substrate alignment and ball release methods, holding a total of 3 patents. His work is characterized by innovative solutions that enhance the efficiency of manufacturing processes.

Latest Patents

One of his latest patents is a "Substrate alignment method and apparatus." This invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate. A vision system is included to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, ensuring that the operation of the vision system is decoupled from the movement of the ball pick head. Drivers responsive to the positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.

Another significant patent is the "Apparatus and method for ball release." This invention discloses a method and apparatus for ensuring the release of objects such as solder balls from a pick head in a transfer and placement apparatus. It involves causing the pick head to vibrate by applying a vibration signal over a range of frequencies. This range is chosen to bound the resonant frequencies of the pick head, which can be calculated through computer simulation.

Career Highlights

Ping Chun Benson Chong is currently employed at Asm Assembly Automation Limited, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of automated assembly processes.

Collaborations

He collaborates with talented coworkers, including Chi Wah Cheng and Hoi Shuen Joseph Tang, contributing to a dynamic and innovative work environment.

Conclusion

Ping Chun Benson Chong's contributions to the field of invention, particularly in substrate alignment and ball release methods, showcase his expertise and commitment to innovation. His patents reflect a deep understanding of manufacturing processes and a drive to improve efficiency in the industry.