The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6983872 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 10, 2006

Filed:

Jun. 03, 2003
Applicants:

Chi Wah Cheng, Tsing Yi, CN;

Ping Chun Benson Chong, Kowloon, CN;

Chin Pang Anson Chan, Hong Kong, CN;

Inventors:

Chi Wah Cheng, Tsing Yi, CN;

Ping Chun Benson Chong, Kowloon, CN;

Chin Pang Anson Chan, Hong Kong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 13/08 (2006.01); B23K 31/12 (2006.01); B23Q 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.


Find Patent Forward Citations

Cheng, Chi. (2006). Substrate alignment method and apparatus (U.S. Patent No. 6983872). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6983872

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