This inventor holds 1 USPTO granted patent. Top assignee: Asm Assembly Automation Limited. Active years: 2006.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2006
Title: Chin Pang Anson Chan and Substrate Alignment Technology.
Introduction
Chin Pang Anson Chan is an inventor associated with Hong Kong and Asm Assembly Automation Limited. His listed patent concerns a method and apparatus for aligning substrates during solder-ball placement.
Latest Patents
Chan is credited with 1 patent: “Substrate Alignment Method and Apparatus.” The invention describes a ball pick head that collects multiple solder balls and deposits them onto a substrate. A vision system obtains positional information about the substrate and is mounted on a carrier, decoupling its operation from the movement of the ball pick head. Drivers use the vision system’s positional information to align the substrate and ball pick head for accurate solder-ball placement.
Career Highlights
Chan’s listed invention addresses alignment in an assembly process involving solder balls and substrates. The patent identifies Asm Assembly Automation Limited as his associated company.
Collaborations
The provided information names Chi Wah Cheng and Ping Chun Benson Chong as Chan’s coworkers. It does not specify whether they collaborated with him on this patent.
Conclusion
Chin Pang Anson Chan’s listed patent focuses on coordinating vision-based substrate positioning with solder-ball placement, reflecting an application of alignment technology in assembly automation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile