logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6386422 B1

PDFFull Text
Date of Patent:
May. 14, 2002

Filed:

May. 03, 2001

Solder reflow oven

Applicant:
Inventors:

Chi Wah Cheng, Kwai Chung, HK;

Ping Chun Benson Chong, Kwai Chung, HK;

Hoi Shuen Joseph Tang, Kwai Chung, HK;

Kai Chiu Adam Wu, Kwai Chung, HK;

Ka On Alfred Yue, Kwai Chung, HK;

Assignee:

ASM Assembly Automation Limited, , HK;

Attorney:

Burns, Doane, Swecker & Mathis, L.L.P.

Primary Examiner:

Tom Dunn

Assistant Examiner:

Kiley Stoner

Int. Cl.
CPC ...
B23K 1/00 ; F27D 1/502 ; F27B 9/02 ;
U.S. Cl.
CPC ...
B23K 1/00 ; F27D 1/502 ; F27B 9/02 ;
Abstract

A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber within which the substrates are subject to a solder reflow process, and output means for discharging substrates from the oven for further processing or handling, and means for transferring the substrates through the processing chamber in a first direction towards the output means. The processing chamber comprises a plurality of heating and cooling zones arranged with a constant pitch in the first direction, and the transferring means is adapted to move the substrates in the first direction in stages, with each component moving a distance equal to the pitch between two zones in each stage, whereby the components are moved from zone to zone in stages. In addition each block of each heating zone and each block of each cooling zone is connected to a source of fresh gas, and each block of each heating zone is provided with means for heating the gas, and each block of each cooling zone is provided with means for cooling the gas, and each block is formed with a serpentine channel between the source of fresh gas and at least one opening through which the gas is discharged from the block towards a substrate.

Find Patent Forward Citations

Cheng, Chi. (2002). Solder reflow oven (U.S. Patent No. 6386422). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6386422

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…