This inventor holds 1 USPTO granted patent. Top assignee: Asm Assembly Automation Limited. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Innovations of Ka On Alfred Yue in Solder Reflow Technology
Introduction
Ka On Alfred Yue is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of solder reflow technology, particularly with his innovative designs that enhance the processing of ball grid array substrates. With a total of 1 patent, his work reflects a commitment to advancing manufacturing processes in the electronics industry.
Latest Patents
Yue's most recent patent is for a solder reflow oven designed specifically for the processing of ball grid array substrates bearing solder balls. This invention includes input means for introducing substrates into the oven, a processing chamber where the solder reflow process occurs, and output means for discharging substrates for further processing. The design features a plurality of heating and cooling zones arranged with a constant pitch, allowing for efficient movement of substrates through the processing chamber. Each heating and cooling zone is equipped with means for heating and cooling gas, ensuring optimal conditions for the solder reflow process.
Career Highlights
Yue is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the field of assembly automation. His work has been instrumental in improving the efficiency and effectiveness of soldering processes in electronic manufacturing. His dedication to research and development has positioned him as a key figure in his company.
Collaborations
Yue has collaborated with several talented individuals in his field, including Chi Wah Cheng and Ping Chun Benson Chong. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Ka On Alfred Yue's contributions to solder reflow technology exemplify the spirit of innovation in the electronics industry. His patent for a solder reflow oven showcases his ability to address complex manufacturing challenges. Through his work at Asm Assembly Automation Limited and collaborations with fellow professionals, Yue continues to make a significant impact in his field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile