Philippe Chantraine

Title: Innovations of Philippe Chantraine

Introduction

Philippe Chantraine is a notable inventor based in Neuilly-Sur-Seine, France. He has made significant contributions to the field of electronic circuit boards, holding a total of five patents. His work focuses on methods for interconnecting metal layers in multilayer networks, which are crucial for the advancement of electronic technology.

Latest Patents

One of his latest patents is a method for interconnecting a multilayer metal network of an electronic circuit board. This innovative method involves creating an electronic circuit board composed of multiple superimposed metal layers with an insulating layer in between. The insulating layer is designed to be inert to both a catalytic activation bath and the chemical deposition of metal. A via hole is formed in the board, allowing for electroless deposition of metal, which grows from the existing metal layers. Another significant patent involves forming the multi-layer structure of a connection board, where via studs are created on a uniform metal layer that is later etched to form conductors.

Career Highlights

Philippe Chantraine has had a distinguished career, primarily working with Bull S.A., a company known for its expertise in information technology and electronic systems. His innovative approaches have contributed to the development of advanced electronic components, enhancing the efficiency and functionality of circuit boards.

Collaborations

Throughout his career, Philippe has collaborated with notable colleagues such as Pierre Merenda and Daniel Lambert. These partnerships have fostered a creative environment that has led to the successful development of his patented technologies.

Conclusion

Philippe Chantraine's contributions to the field of electronic circuit boards through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.