The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 1995
Filed:
Dec. 18, 1990
Applicant:
Inventors:
Philippe Chantraine, Seine, FR;
Marta Zorilla, Fontenay-le-Fleury, FR;
Assignee:
Bull S.A., Paris, FR;
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 96 ; 427 97 ; 427 98 ; 4274301 ; 4274431 ;
Abstract
A method for interconnecting a multilayer metal network of an electronic circuit board is provided. In the method, the electronic circuit board is made up of a plurality of superimposed metal layers having an insulating layer disposed therebetween, wherein the material of the insulating layer is substantially inert to a catalytic activation bath and to chemical deposition of metal. A via hole is formed in the board having a first metal layer thereof as its bottom and traversing a second metal layer and using electroless deposition, metal is deposited in the via by growing the metal from the metal layers only.