Company Filing History:

7 out of 14,705

Infineon Technologies Ag

Years Active: 2003-2014

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8 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8624372 - Semiconductor component comprising an interposer substrate (2014-01-07),

2. 7948071 - Integrated circuit with re-route layer and stacked die assembly (2011-05-24),

3. 7422930 - Integrated circuit with re-route layer and stacked die assembly (2008-09-09),

4. 7352057 - Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module (2008-04-01),

5. 6910161 - Device and method for reducing the number of addresses of faulty memory cells (2005-06-21),

6. 6897101 - Method for writing to the magnetoresistive memory cells of an integrated magnetoresistive semiconductor memory (2005-05-24),

7. 6721230 - Integrated memory with memory cells in a plurality of memory cell blocks, and method of operating such a memory (2004-04-13),

8. 6608796 - Circuit configuration for controlling the word lines of a memory matrix (2003-08-19),

Title: The Innovations of Inventor Peter Weitz

Introduction

Peter Weitz, an accomplished inventor based in Sauerlach, Germany, has made significant contributions to the field of semiconductor technology. With a portfolio of eight patents, his work focuses on advancing the functionality and design of semiconductor components.

Latest Patents

Among his notable inventions, Weitz has developed a semiconductor component that includes an interposer substrate as a stack element in a semiconductor component stack. This innovative design features a semiconductor chip that is uniquely protected by a plastics composition along its side edges, while the edge regions of the interposer substrate remain free from any plastics composition, allowing for external contact pads that are electrically interconnected via through contacts.

Another groundbreaking patent involves an integrated circuit with a re-route layer and a stacked die assembly. This invention details a method for manufacturing a stacked-die assembly, involving the careful placement of multiple dies on a substrate with electrical coupling provided by wire leads. Such systems increase the efficiency and density of integrated circuits, demonstrating Weitz's dedication to pushing the boundaries of semiconductor technology.

Career Highlights

Weitz's career includes notable roles at reputable firms, particularly Infineon Technologies AG and Qimonda AG. His experience at these companies has informed his innovative practices and allowed him to develop solutions that address real-world technological challenges.

Collaborations

Throughout his career, Peter Weitz has collaborated with talented professionals, including Jochen Thomas and Jurgen Grafe. These partnerships have facilitated the advancement of several key projects and have contributed to the development of his patent portfolio.

Conclusion

Peter Weitz stands out as a prominent figure in the semiconductor industry due to his innovative patents and extensive collaboration with industry experts. His work continues to influence the future of technology, establishing benchmarks for the design and application of semiconductor components.

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