The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Aug. 22, 2006
Wolfgang Hetzel, Nattheim, DE;
Jochen Thomas, Munich, DE;
Peter Weitz, Sauerlach, DE;
Ingo Wennemuth, Munich, DE;
Wolfgang Hetzel, Nattheim, DE;
Jochen Thomas, Munich, DE;
Peter Weitz, Sauerlach, DE;
Ingo Wennemuth, Munich, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A semiconductor component () has an interposer substrate () as stack element of a semiconductor component stack (). The interposer substrate () has, on one of the interposer substrate sides (), a semiconductor chip protected by plastics composition () in its side edges (). An interposer structure () partly covered by a plastics composition () is arranged on the interposer side () opposite to the semiconductor chip (). Edge regions () of the interposer substrate () remain free of any plastics composition () and have, on both interposer sides () external contact pads () which are electrically connected to one another via through contacts ().