The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2008
Filed:
Mar. 02, 2004
Jochen Thomas, Muenchen, DE;
Peter Weitz, Sauerlach, DE;
Jurgen Grafe, Dresden, DE;
Harry Hedler, Germering, DE;
Jens Pohl, Bernhardswald, DE;
Jochen Thomas, Muenchen, DE;
Peter Weitz, Sauerlach, DE;
Jurgen Grafe, Dresden, DE;
Harry Hedler, Germering, DE;
Jens Pohl, Bernhardswald, DE;
Infineon Technologies AG, Munich, DE;
Abstract
An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is coupled to the substrate, preferably by an adhesive. Wire leads electrically couple the bond pads of the first die to contacts on the substrate. A second die is placed on the first die, and wire leads electrically couple the bond pads of the second die to contacts on the substrate. Preferably, a spacer is placed between the first die and the second die. Additional dies may be stacked on the second die.