Perre Kao

Title: The Innovative Contributions of Perre Kao

Introduction

Perre Kao is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on methods that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents, Kao has developed a method of forming conductive bumps for cooling device connections. This method involves preparing a semiconductor substrate with metal bumps on both sides. The process includes depositing a first-side UBM layer on a first surface of the substrate, followed by the formation of a plurality of first-side metal bumps. Additionally, a second-side UBM layer is formed on the opposite side, with corresponding second-side metal bumps created thereafter. The method also entails the removal of exposed UBM layers and the reflowing of the metal bumps to ensure optimal connectivity and performance.

Career Highlights

Perre Kao is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative approaches have contributed to advancements in semiconductor manufacturing processes, making him a valuable asset to his organization.

Collaborations

Kao has collaborated with esteemed colleagues such as You-Hua Chou and Yi-Jen Lai. Their combined expertise has fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Perre Kao's work in semiconductor technology exemplifies the spirit of innovation. His patents and contributions continue to influence the industry, showcasing the importance of research and development in advancing technology.