The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2015
Filed:
Feb. 24, 2011
Applicants:
You-hua Chou, Taipei, TW;
Yi-jen Lai, Chang Hua, TW;
Chun-jen Chen, Jhubei, TW;
Perre Kao, Tainan, TW;
Inventors:
You-Hua Chou, Taipei, TW;
Yi-Jen Lai, Chang Hua, TW;
Chun-Jen Chen, Jhubei, TW;
Perre Kao, Tainan, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/42 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/15311 (2013.01);
Abstract
The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition, the metal bumps allow customization of bump designs to meet the needs of different chips. Further, the usage of metal bumps between the semiconductor chip and cooling device enables advanced cooling by passing a cooling fluid between the bumps.