Paweena Phatto

Title: Paweena Phatto: Innovator in Semiconductor Packaging

Introduction

Paweena Phatto is a prominent inventor based in Bangkok, Thailand. She has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. Her innovative work has paved the way for advancements in the technology sector.

Latest Patents

Among her latest patents, Paweena has developed a hermetic semiconductor package. This invention includes a package substrate with a die cavity where a die is attached. The package also features a cavity for bonding a cap, which is sealed using sealing rings to form a hermetic package. Another notable patent is her method for forming a cavity wall structure for semiconductor packaging. This method involves creating a package substrate with a recess region that houses a semiconductor die, surrounded by a dam structure that facilitates the dispensing of a liquid encapsulant material.

Career Highlights

Paweena Phatto is currently employed at Utac Headquarters Pte. Ltd., where she continues to innovate in semiconductor technology. Her work has been instrumental in enhancing the reliability and performance of semiconductor packages.

Collaborations

Throughout her career, Paweena has collaborated with notable colleagues, including Hua Hong Tan and Wilson Poh Leng Ong. These partnerships have contributed to her success and the advancement of her projects.

Conclusion

Paweena Phatto's contributions to semiconductor packaging demonstrate her expertise and commitment to innovation. Her patents reflect her ability to address complex challenges in the industry, making her a valuable asset in the field of technology.