The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Jul. 29, 2021
Applicant:
Utac Headquarters Pte. Ltd., Singapore, SG;
Inventors:
Eakkasit Dumsong, Bangkok, TH;
Mike Jayson Candelario, Bangkok, TH;
Phongsak Sawasdee, Bangkok, TH;
Jiraphat Charoenratpratoom, Bangkok, TH;
Paweena Phatto, Bangkok, TH;
Maythichai Saithong, Bangkok, TH;
Assignee:
UTAC Headquarters Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 21/52 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 21/52 (2013.01); H01L 23/564 (2013.01);
Abstract
A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.