Modesto, CA, United States of America

Paul R Hoffman


Average Co-Inventor Count = 3.1

ph-index = 13

Forward Citations = 589(Granted Patents)


Location History:

  • Santa Clara, CA (US) (1993)
  • Modesto, CA (US) (1993 - 2001)

Company Filing History:


Years Active: 1993-2001

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18 patents (USPTO):

Title: The Innovative Journey of Paul R. Hoffman

Introduction: Paul R. Hoffman, a notable inventor based in Modesto, California, has made significant contributions to the field of electronics through his innovative designs and technologies. With a remarkable total of 18 patents to his name, Hoffman's work stands at the intersection of electrical engineering and practical application in semiconductor devices.

Latest Patents: Among his latest contributions are noteworthy patents such as the **Edge Connectable Metal Package** and the **Ball Grid Array Electronic Package**. The Edge Connectable Metal Package features a metallic base partially coated with a dielectric layer, enabling effective interconnection to an encased semiconductor device through either a leadframe or a circuit trace. This design extends to the package perimeter, facilitating connections to sockets or external leads. Meanwhile, the Ball Grid Array Electronic Package is characterized by a metallic base that includes conductive vias, which extend through the base's holes, effectively maintaining the necessary electrical isolation required by modern semiconductor applications.

Career Highlights: Throughout his career, Hoffman has been associated with reputable companies such as Olin Corporation and Advanced Interconnect Technologies Limited. His experience in these organizations has been instrumental in refining his inventions and contributing to advancements in electronic packaging technologies.

Collaborations: Hoffman's innovative journey has also been shaped by collaborations with esteemed colleagues, including Deepak Mahulikar and George A. Brathwaite. Working alongside these talented professionals, he has been able to push the boundaries of technology, further enhancing the functionalities of electronic packages.

Conclusion: Paul R. Hoffman exemplifies the spirit of innovation through his extensive work and patents, furthering the development of semiconductor technologies. His latest inventions not only reflect his expertise but also showcase his commitment to advancing the field, positioning him as a significant contributor to modern electronic design.

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