The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 1996
Filed:
Mar. 29, 1994
Applicant:
Inventors:
Paul R Hoffman, Modesto, CA (US);
Deepak Mahulikar, Madison, CT (US);
George A Brathwaite, Hayward, CA (US);
Dawit Solomon, Manteca, CA (US);
Arvind Parthasarathi, North Branford, CT (US);
Assignee:
Olin Corporation, Manteca, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257691 ; 257693 ; 257713 ; 257730 ; 257784 ;
Abstract
There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.