The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2001
Filed:
Mar. 19, 1993
Applicant:
Inventors:
Deepak Mahulikar, Madison, CT (US);
Paul R. Hoffman, Modesto, CA (US);
Jeffrey S. Braden, Livermore, CA (US);
Assignee:
Advanced Interconnect Technologies, Manteca, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/304 ;
U.S. Cl.
CPC ...
H01L 2/304 ;
Abstract
There is provided a ball grid array package for housing semiconductor devices. The package has a metallic base with conductive vias extending through holes formed in the base. The conductive vias terminate adjacent an exterior surface of the base. A dielectric coating on at least part of the base and through hole walls electrically isolates the metallic base from the package circuitry.