This inventor holds 3 USPTO granted patents and 1 published patent application and 2 EPO patents. Top assignees: Imec Vzw, Katholieke Universiteit Leuven, University of Ghent. Active years: 2013-2016.
Location History:
- Kapeldreef, BE (2014)
- Leuven, BE (2013 - 2016)
Company Filing History:



Years Active: 2013-2016
Title: Paresh Limaye: Innovator in Semiconductor Technology
Introduction
Paresh Limaye is a notable inventor based in Leuven, Belgium. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods and devices that enhance the performance and efficiency of semiconductor applications.
Latest Patents
One of his latest patents is titled "Method for Insertion Bonding and Device Thus Obtained." This invention discloses a method for insertion bonding, where a device includes a first substrate with a protrusion and a second substrate with a hole. The design allows for the protrusion to be inserted into the hole, creating a bond through deformation during insertion. Another significant patent is "Window Interposed Die Packaging," which describes a semiconductor device utilizing the interposer principle. This device comprises a window substrate with a cavity for mounting semiconductor dies, facilitating connections to other levels of assembly.
Career Highlights
Throughout his career, Paresh Limaye has worked with prominent organizations such as Imec Vzw and Katholieke Universiteit Leuven. His experience in these institutions has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations
Paresh has collaborated with esteemed colleagues, including Eric Beyne and Jan Vanfleteren. Their combined expertise has contributed to advancements in the field and the successful development of new technologies.
Conclusion
Paresh Limaye's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative methods and devices continue to shape the future of the industry.