The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2013

Filed:

Jul. 30, 2010
Applicants:

Paresh Limaye, Leuven, BE;

Jan Vanfleteren, Gentbrugge, BE;

Eric Beyne, Leuven, BE;

Inventors:

Paresh Limaye, Leuven, BE;

Jan Vanfleteren, Gentbrugge, BE;

Eric Beyne, Leuven, BE;

Assignees:

IMEC, Leuven, BE;

Katholieke Universiteit Leuven, Leuven, BE;

Universiteit Gent, Gent, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.


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