The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Jul. 07, 2010
Applicants:

Eric Beyne, Leuven, BE;

Paresh Limaye, Leuven, BE;

Inventors:

Eric Beyne, Leuven, BE;

Paresh Limaye, Leuven, BE;

Assignees:

IMEC, Leuven, BE;

Katholieke Universiteit Leuven, Leuven, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81801 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A method for insertion bonding and a device thus obtained are disclosed. In one aspect, the device includes a first substrate having a front main surface and at least one protrusion at the front main surface. The device includes a second substrate having a front main surface and at least one hole extending from the front main surface into the second substrate. The protrusion of the first substrate is inserted into the hole of the second substrate. The hole is formed in a shape wherein the width is reduced in the depth direction and wherein the width of at least a part of the hole is smaller than the width of the protrusion at the location of the metal portion thereof. The protrusion is deformed during insertion thereof in the hole to provide a bond between the part of the hole and the metal portion.


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