Pao-Tung Chen

This inventor holds 40 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2011-2025.

USPTO Granted Patents = 40 (Patent Applications = 1)

% Patents Active = 80.0

Average Co-Inventor Count = 5.1

ph-index = 6

Forward Citations = 338(Granted Patents)

Location History:

Hsin Chu, TW (2017)
Tainan, TW (2016 - 2023)
Tainan Hsien, TW (2011 - 2024)

Company Filing History:

40 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2011-2025

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Areas of Expertise:

3DIC Seal Ring

Image Sensor Packaging

Hybrid-Bonding

Via Last Through-Vias

Infrared Image Sensor

Stacked Integrated Circuits

Charge Transfer

Backside Illuminated Sensor

Glass Removal

Shield Structure

Metal Line Design

Elevated Photodiode

40 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12396283 - 3DIC seal ring structure and methods of forming same (2025-08-19),

2. 11978758 - Methods and apparatus for via last through-vias (2024-05-07),

3. 11646247 - Ion through-substrate via (2023-05-09),

4. 11600653 - Methods and apparatus for via last through-vias (2023-03-07),

5. 11552027 - Semiconductor packaging device comprising a shield structure (2023-01-10),

6. 11545443 - Method for forming hybrid-bonding structure (2023-01-03),

7. 11532661 - 3DIC seal ring structure and methods of forming same (2022-12-20),

8. 11037885 - Semiconductor packaging device comprising a shield structure (2021-06-15),

9. 10930699 - Method and apparatus for image sensor packaging (2021-02-23),

10. 10867891 - Ion through-substrate via (2020-12-15),

11. 10790240 - Metal line design for hybrid-bonding application (2020-09-29),

12. 10777539 - Seal-ring structure for stacking integrated circuits (2020-09-15),

13. 10510792 - 3DIC seal ring structure and methods of forming same (2019-12-17),

14. 10510791 - Elevated photodiode with a stacked scheme (2019-12-17),

15. 10475843 - Method and apparatus for image sensor packaging (2019-11-12),

Title: The Innovative Journey of Pao-Tung Chen

Introduction:

Pao-Tung Chen, a distinguished inventor hailing from Tainan Hsien, TW, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Pao-Tung Chen's latest patents showcase his commitment to pushing the boundaries of technological advancement, with a focus on improving efficiency and functionality in various industries.

Career Highlights:

Throughout his illustrious career, Pao-Tung Chen has consistently demonstrated a keen eye for innovation, leading to the development of numerous revolutionary products that have transformed the way we live and work.

Collaborations:

Pao-Tung Chen has collaborated with some of the brightest minds in the industry, pooling together expertise to create cutting-edge solutions that have garnered international acclaim.

Conclusion:

In conclusion, Pao-Tung Chen's relentless pursuit of innovation and his passion for creating a positive impact on society have solidified his position as a trailblazer in the world of technology.