Yongin-si, South Korea

PaLan Lee


Average Co-Inventor Count = 6.3

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Yongin-si, KR (2012 - 2013)
  • Daegu, KR (2016)

Company Filing History:


Years Active: 2012-2016

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of PaLan Lee

Introduction

PaLan Lee is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of display technology and semiconductor devices. With a total of 3 patents to his name, Lee continues to push the boundaries of innovation in his industry.

Latest Patents

One of Lee's latest patents is a display apparatus that includes a display panel and a flexible circuit film. This innovative design features a chip mounted on the front surface of the flexible circuit film, which is electrically connected to the display panel. The lead bonding portion of this apparatus is intricately designed to ensure optimal functionality.

Another notable patent is a method of forming a semiconductor device package. This method involves creating a first package with a chip on a substrate and a second package with a second chip. The process includes forming a molding cap with a via hole and a recess structure, allowing for efficient assembly of the semiconductor package.

Career Highlights

PaLan Lee is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in developing cutting-edge technologies. His work has been instrumental in advancing the company's product offerings in the competitive electronics market.

Collaborations

Lee collaborates with talented coworkers, including Soyoung Lim and Yonghoon Kim. Together, they contribute to innovative projects that enhance the capabilities of their products.

Conclusion

PaLan Lee's contributions to display technology and semiconductor devices exemplify his commitment to innovation. His patents reflect a deep understanding of complex engineering principles and a drive to improve technology for future applications.

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