The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Jun. 01, 2010
Applicants:
Yonghoon Kim, Suwon-si, KR;
Heeseok Lee, Yongin-si, KR;
Eunseok Cho, Suwon-si, KR;
Hyuna Kim, Hwaseong-si, KR;
Soyoung Lim, Hwaseong-si, KR;
Palan Lee, Yongin-si, KR;
Inventors:
Yonghoon Kim, Suwon-si, KR;
Heeseok Lee, Yongin-si, KR;
Eunseok Cho, Suwon-si, KR;
Hyuna Kim, Hwaseong-si, KR;
Soyoung Lim, Hwaseong-si, KR;
PaLan Lee, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.