The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
May. 27, 2010
Choongbin Yim, Cheonan-si, KR;
Seungkon Mok, Suwon-si, KR;
Donghan Kim, Osan-si, KR;
Jin-woo Park, Seoul, KR;
Palan Lee, Yongin-si, KR;
Mi-yeon Kim, Asan-si, KR;
Choongbin Yim, Cheonan-si, KR;
Seungkon Mok, Suwon-si, KR;
Donghan Kim, Osan-si, KR;
Jin-Woo Park, Seoul, KR;
PaLan Lee, Yongin-si, KR;
Mi-yeon Kim, Asan-si, KR;
Samsung Electronics Co. Ltd., Suwon-Si, KR;
Abstract
Provided is a method of forming a semiconductor package. In the method, a first package including a first chip on a first substrate is formed, a second package including a second chip on a second substrate is formed, a molding cap provided with a via hole and a recess structure configured to receive the first chip is formed, and the second package is provided on the first package with the molding cap being therebetween such that the recess receives the first chip. The via hole and the recess structure are simultaneously formed.