Suwon-si, South Korea

Seungkon Mok

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2013-2023

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6 patents (USPTO):

Title: The Innovative Contributions of Seungkon Mok

Introduction

Seungkon Mok is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His work is particularly recognized for its impact on the efficiency and functionality of semiconductor packages.

Latest Patents

Mok's latest patents focus on advanced semiconductor packages. One notable patent describes a semiconductor package that includes a circuit substrate with multiple interconnections. This package features a first chip placed on the circuit substrate, with a second chip stacked on top of the first. It also includes a plurality of first pads that overlap the first chip, along with bumps between the circuit substrate and the first chip. Additionally, the design incorporates second pads on the edge of the circuit substrate, which are electrically connected to the second chip through conductive wires. An underfill material fills the space between the circuit substrate and the first chip, while a first dam, made of conductive material, overlaps at least one of the interconnections.

Career Highlights

Seungkon Mok is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technology. His work has contributed to the advancement of electronic devices, enhancing their performance and reliability.

Collaborations

Mok has collaborated with notable colleagues, including Jongho Park and Kyungsuk Oh. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Seungkon Mok's contributions to semiconductor technology exemplify the spirit of innovation. His patents reflect a deep understanding of the complexities involved in semiconductor packaging, and his work continues to influence the industry.

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