The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Aug. 12, 2016
Yunhyeok Im, Hwaseongi-si, KR;
Oleg Feygenson, Hwaseongi-si, KR;
Sang IL Kim, Seoul, KR;
Youngbae Kim, Hwaseongi-si, KR;
Jichul Kim, Yongin-si, KR;
Seungkon Mok, Suwon-si, KR;
Jungsu Ha, Osan-si, KR;
Yunhyeok Im, Hwaseongi-si, KR;
Oleg Feygenson, Hwaseongi-si, KR;
Sang Il Kim, Seoul, KR;
Youngbae Kim, Hwaseongi-si, KR;
Jichul Kim, Yongin-si, KR;
Seungkon Mok, Suwon-si, KR;
Jungsu Ha, Osan-si, KR;
Abstract
Semiconductor packages and methods of fabricating the same are disclosed. The semiconductor package may include a package substrate, a semiconductor chip, which is mounted on the package substrate to have a bottom surface facing the package substrate and a top surface opposite to the bottom surface, a mold layer provided on the package substrate to encapsulate the semiconductor chip, and a heat dissipation layer provided on the top surface of the semiconductor chip. The mold layer may have a top surface substantially coplanar with the top surface of the semiconductor chip, and the top surfaces of the semiconductor chip and the mold layer may have a difference in surface roughness from each other.