Samsung Electronics Co., Ltd.

PaLan Lee

Soyoung Lim

Jin-Woo Park

Donghan Kim

Heeseok Lee

Yonghoon Kim

Jeong-Kyu Ha

Jae-Min Jung

Choongbin Yim

KyongSoon Cho

Eunseok Cho

Mi-Yeon Kim

Hyuna Kim

Seungkon Mok

Kyoungsuk Yang

Narae Shin

Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

Display apparatus

Provided is a method of forming a semiconductor package. In the method, a first package including a first chip on a first substrate is formed, a second package including a second chip on a second substrate is formed, a molding cap provided with a via hole and a recess structure configured to receive the first chip is formed, and the second package is provided on the first package with the molding cap being therebetween such that the recess receives the first chip. The via hole and the recess structure are simultaneously formed.

Method of forming a semiconductor device package

A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate.

Semiconductor packages including heat slugs

Growing community of inventors

Yongin-si, South Korea

PaLan Lee