San Jose, CA, United States of America

Padam Jain

USPTO Granted Patents = 9 

 

Average Co-Inventor Count = 6.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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9 patents (USPTO):Explore Patents

Title: Innovations of Padam Jain

Introduction

Padam Jain is a notable inventor based in San Jose, CA, who has made significant contributions to the field of integrated circuit packaging. With a total of 9 patents to his name, Jain's work focuses on enhancing the efficiency and reliability of electronic components.

Latest Patents

Among his latest patents is the "Compliant pad spacer for three-dimensional integrated circuit package." This invention provides a compliant pad spacer that supports substrates or boards, such as packing substrates, interposers, or printed circuit boards (PCBs). The design minimizes the effects of substrate warpage or structural collapse in integrated circuit packaging. The compliant pad spacer is made from insulating materials, including silicon-based polymer composites with ceramic fillers.

Another significant patent is the "Spring loaded compliant coolant distribution manifold for direct liquid cooled modules." This invention utilizes spring force-based compliance to reduce bypass liquid flow gaps between chip microfins and manifold ports. The fluid delivery and exhaust manifold structure allows for direct liquid cooling of a module, enhancing heat transfer between the chip and the working fluid. The design also incorporates pressure reduction features to manage pressure differentials effectively.

Career Highlights

Padam Jain is currently employed at Google Inc., where he continues to innovate and develop advanced technologies in the field of electronics. His work has been instrumental in improving the performance and reliability of integrated circuits.

Collaborations

Throughout his career, Jain has collaborated with talented individuals such as Madhusudan K Iyengar and Connor Burgess, contributing to various projects and advancements in technology.

Conclusion

Padam Jain's contributions to the field of integrated circuit packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.

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